The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Feb. 21, 2018
International Business Machines Corporation, Armonk, NY (US);
Xiaoxiong Gu, White Plains, NY (US);
Wooram Lee, Briarcliff Manor, NY (US);
Duixian Liu, Scarsdale, NY (US);
Christian Wilhelmus Baks, Pleasant Valley, NY (US);
Alberto Valdes-Garcia, Chappaqua, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.