The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Jan. 29, 2019
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Hirotaka Obuchi, Kyoto, JP;
Junichi Itai, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/06 (2010.01); H01L 33/12 (2010.01); H01L 33/62 (2010.01); H01L 33/32 (2010.01); H01L 33/42 (2010.01); H01L 33/60 (2010.01); H01L 33/14 (2010.01); H01L 51/52 (2006.01); H01L 51/10 (2006.01); H01L 51/44 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/06 (2013.01); H01L 33/12 (2013.01); H01L 33/145 (2013.01); H01L 33/32 (2013.01); H01L 33/42 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/58 (2013.01); H01L 51/107 (2013.01); H01L 51/448 (2013.01); H01L 51/5246 (2013.01);
Abstract
A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.