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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10784415 B1

PDFFull Text
Date of Patent:
Sep. 22, 2020

Filed:

Jan. 22, 2019

Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same

Applicant:

Seoul Semiconductor Co., Ltd, Ansan-si, KR;

Inventors:

Jung Hwa Jung, Ansan-si, KR;

Seoung Ho Jung, Ansan-si, KR;

Sung Ki Hwang, Ansan-si, KR;

Assignee:

SEOUL SEMICONDUCTOR CO., LTD., Ansan-si, KR;

Attorney:

Perkins Coie LLP

Primary Examiner:

Tu-Tu V Ho

Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/58 (2010.01); H01L 25/075 (2006.01); H01L 33/14 (2010.01); H01L 33/20 (2010.01); H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 27/156 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/14 (2013.01); H01L 33/20 (2013.01); H01L 33/36 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.

Find Patent Forward Citations

Jung, Jung. (2020). Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same (U.S. Patent No. 10784415). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10784415

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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