The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Dec. 07, 2019
Applicant:

Guangdong University of Technology, Guangzhou, Guangdong, CN;

Inventors:

Yun Chen, Guangzhou, CN;

Dachuang Shi, Guangzhou, CN;

Xin Chen, Guangzhou, CN;

Qiang Liu, Guangzhou, CN;

Jian Gao, Guangzhou, CN;

Ching-Ping Wong, Atlanta, GA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 21/6835 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83085 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83097 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.


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