The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Apr. 27, 2018
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Alfred Goerlach, Kusterdingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 29/78 (2006.01); H01L 27/08 (2006.01); H01L 23/00 (2006.01); H01L 29/861 (2006.01); H01L 23/051 (2006.01); H01L 27/07 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 23/051 (2013.01); H01L 24/01 (2013.01); H01L 27/0727 (2013.01); H01L 27/0814 (2013.01); H01L 29/78 (2013.01); H01L 29/8611 (2013.01);
Abstract

A diode is provided having a plate-shaped semiconductor element that includes a first side and a second side, the first side being connected by a first connecting layer to a first metallic contact and the second side being connected by a second connecting layer to a second metallic contact, the first side having a diode element in a middle area and having a further diode element in an edge area of the first side, which has crystal defects as a result of a separating process of the plate-shaped semiconductor element, the first connecting layer only establishing an electrical contact to the diode element and not to the further diode element and, on the first side, the further diode element having an exposed contact, which may be electrically contacted by the first connecting layer.


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