The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

May. 10, 2018
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Li Xiao, Beijing, CN;

Tingting Zhou, Beijing, CN;

Xiaochuan Chen, Beijing, CN;

Shengji Yang, Beijing, CN;

Dongni Liu, Beijing, CN;

Lei Wang, Beijing, CN;

Jie Fu, Beijing, CN;

Pengcheng Lu, Beijing, CN;

Han Yue, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 27/12 (2013.01); H01L 27/3244 (2013.01); G02F 1/13452 (2013.01); H01L 27/3276 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/05686 (2013.01); H01L 2227/32 (2013.01); H01L 2227/323 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/10253 (2013.01);
Abstract

The present disclosure provides a display apparatus and a manufacturing method thereof. The display apparatus includes a silicon substrate, a plurality of metal data interfaces disposed on the silicon substrate, and a plurality of conductive patterns covering upper surfaces of the metal data interfaces respectively. The plurality of the conductive patterns is formed by enabling a semiconductor material to be conductive and the plurality of conductive patterns are not contacted with each other.


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