The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jan. 26, 2018
Applicant:

Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, CN;

Inventors:

Ziyang Gao, Hong Kong, CN;

Shek Mong Wong, Hong Kong, CN;

Tak Lok Shum, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 27/02 (2006.01); H01L 29/20 (2006.01); H01L 29/778 (2006.01); H02M 7/00 (2006.01); H02M 1/00 (2006.01); H02M 1/088 (2006.01); H02M 3/335 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49844 (2013.01); H01L 24/16 (2013.01); H01L 25/072 (2013.01); H01L 27/0255 (2013.01); H01L 29/2003 (2013.01); H01L 29/7787 (2013.01); H02M 7/003 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/30107 (2013.01); H02M 1/088 (2013.01); H02M 3/33592 (2013.01); H02M 2001/0054 (2013.01); H02M 2001/0058 (2013.01);
Abstract

A power device package includes a substrate, a high side power device, a low side power device and a driver device. The substrate includes a top surface, a bottom surface and a plurality of vias that extend through the substrate. The high side and low side power devices are disposed on the top surface of the substrate and connected with each other. The driver device is disposed on the bottom surface of the substrate and electrically connected with the high side and low side power devices through the vias to drive the high side and low side power devices in response to a control signal. The distance between the driver device and the high side and low side power devices is determined by the thickness of the substrate such that that a parasitic inductance between the driver device and the high side power device or the low side power device is reduced.


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