The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Feb. 26, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventor:

Rikihiro Maruyama, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/049 (2006.01); H01L 21/48 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/049 (2013.01); H01L 21/4817 (2013.01); H01L 23/10 (2013.01);
Abstract

A case of a semiconductor device has sidewall portions which surround sides of a metal substrate along the sides and a coating portion which covers the front surface of the metal substrate surrounded by the sidewall portions and which has through ring holes corresponding to fixing holes. Protrusions are formed on inner surfaces of the sidewall portions opposed to one another in plan view with the ring holes therebetween. The metal substrate is inserted in this way into an area surrounded by the sidewall portions of the case and is reliably fixed. Furthermore, alignment is performed with accuracy between each fixing hole of the metal substrate inserted in this way and its corresponding ring hole of the case.


Find Patent Forward Citations

Loading…