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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10784172 B1

PDFFull Text
Date of Patent:
Sep. 22, 2020

Filed:

Feb. 15, 2018

Testing solid state devices before completing manufacture

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Cody Michael Berger, Melissa, TX (US);

Ramana Tadepalli, McKinney, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Rose Alyssa Keagy

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Christopher P McAndrew

Int. Cl.
CPC ...
G01R 31/18 (2006.01); H01L 29/24 (2006.01); G01R 31/26 (2020.01); H01L 29/778 (2006.01); H01L 21/66 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01R 31/18 (2013.01); G01R 31/2601 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); H01L 29/16 (2013.01); H01L 29/20 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/24 (2013.01); H01L 29/402 (2013.01); H01L 29/408 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01);
Abstract

In some examples, a method for manufacturing a solid state device comprises forming a first layer of the solid state device; forming a conductive layer of the solid state device above the first layer, the conductive layer having an access pad formed on an end of the conductive layer; applying a voltage to the conductive layer using the access pad, the voltage forming an electric field in an area of the first layer beneath the conductive layer; and completing manufacture of the solid state device after applying the voltage.

Find Patent Forward Citations

Berger, Cody. (2020). Testing solid state devices before completing manufacture (U.S. Patent No. 10784172). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10784172

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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