The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Dec. 12, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Joong-Ha Lee, Suwon-si, KR;
Sang-Yoon Kim, Hwaseong-si, KR;
YoungBum Kim, Yongin-si, KR;
Hui-Jae Kim, Seoul, KR;
SeungDae Seok, Yongin-si, KR;
Jaebong Shin, Gunpo-si, KR;
Byungjoon Lee, Yongin-si, KR;
Yongin Lee, Seoul, KR;
Jaeyeon Pyo, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Abstract
A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.