The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Sep. 11, 2018
Applicant:

Complete Genomics, Inc., San Jose, CA (US);

Inventors:

Shifeng Li, Fremont, CA (US);

Jian Gong, Danville, CA (US);

Yan-You Lin, Fremont, CA (US);

Cheng Frank Zhong, Menlo Park, CA (US);

Assignee:

MGI TECH CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 21/28 (2006.01); G01N 21/64 (2006.01); G01N 21/05 (2006.01); G01N 33/487 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/022 (2013.01); B01L 3/502707 (2013.01); G01N 21/05 (2013.01); G01N 21/6454 (2013.01); G01N 33/48707 (2013.01); H01L 21/02131 (2013.01); H01L 21/02175 (2013.01); H01L 21/02266 (2013.01); H01L 21/02422 (2013.01); H01L 21/28264 (2013.01); H01L 29/20 (2013.01); B01L 3/502715 (2013.01); B01L 3/502784 (2013.01); B01L 2300/0663 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0861 (2013.01); B01L 2300/0877 (2013.01); B01L 2300/165 (2013.01); G01N 2021/058 (2013.01);
Abstract

A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.


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