The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jun. 03, 2016
Applicant:

Hutchinson Technology Incorporated, Hutchinson, MN (US);

Inventors:

Kyle T. Tobias, Hutchinson, MN (US);

Lawrence E. LaLonde, Hutchinson, MN (US);

Darrell C. Sydlo, Hutchinson, MN (US);

Assignee:

Hutchinson Technology Incorporated, Hutchinson, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); H04R 31/00 (2006.01); G11B 5/48 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4833 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); G03F 7/40 (2013.01);
Abstract

Disk drive head suspension components having microstructured surfaces and a method for making the components. One embodiment of the method includes depositing a layer of photoimageable polymer having an associated set of process parameters including a minimum resolution and exposing the photoimageable polymer through a photomask having a microstructure-producing region with features below the minimum resolution for the photoimageable polymer. The exposed photoimageable polymer is developed to produce a layer of polymer having a thickness and a microstructured surface region with depressions that are less than the thickness of the polymer. In one embodiment the photomask has a microstructure-producing region with features sized and spaced between about 1 μm and 10 μm. Microstructured surfaces on structures such as flying leads, flying termination pads, cover coat layers and at insulating layer-trace interfaces and insulating layer-cover coat interfaces can be manufactured.


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