The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Dec. 14, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ali Afzali-Ardakani, Ossining, NY (US);

Homa Alemzadeh, Crozet, VA (US);

Maryam Ashoori, White Plains, NY (US);

Bahman Hekmatshoartabari, White Plains, NY (US);

Elham Khabiri, Briarcliff Manor, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/30 (2006.01); G06K 7/10 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); G01D 18/00 (2006.01); G06N 20/00 (2019.01); G01D 21/00 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); G06N 3/04 (2006.01);
U.S. Cl.
CPC ...
G06K 7/10198 (2013.01); G01D 18/00 (2013.01); G01D 21/00 (2013.01); G06K 7/10316 (2013.01); G06K 7/10465 (2013.01); G06N 20/00 (2019.01); H01L 21/56 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); G06N 3/0445 (2013.01); G06N 3/0454 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01);
Abstract

Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.


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