The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Feb. 04, 2019
Applicant:

Sinovia Technologies, San Carlos, CA (US);

Inventors:

Whitney Gaynor, Menlo Park, CA (US);

George Burkhard, Redwood City, CA (US);

Assignee:

Sinovia Technologies, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); B82Y 40/00 (2011.01); G03F 7/16 (2006.01); B82Y 10/00 (2011.01); G03F 1/24 (2012.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H01B 1/16 (2006.01); H01B 1/22 (2006.01); H01B 13/00 (2006.01); H01B 5/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); B82Y 20/00 (2011.01); G03F 7/038 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B05D 3/007 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 1/24 (2013.01); G03F 7/0002 (2013.01); G03F 7/0047 (2013.01); G03F 7/161 (2013.01); G06F 3/044 (2013.01); H01B 1/16 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01B 13/0013 (2013.01); H05K 1/0271 (2013.01); H05K 1/0274 (2013.01); H05K 1/036 (2013.01); H05K 1/09 (2013.01); H05K 3/103 (2013.01); B82Y 20/00 (2013.01); G03F 7/038 (2013.01); G03F 7/0388 (2013.01); G06F 2203/04103 (2013.01); H01L 51/444 (2013.01); H01L 51/5203 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0137 (2013.01); H05K 2203/10 (2013.01); Y10T 428/24355 (2015.01); Y10T 442/10 (2015.04); Y10T 442/188 (2015.04); Y10T 442/191 (2015.04);
Abstract

A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of cross-linkable polymer while the cross-linkable polymer is in a substantially noncross-linked state. The method further includes introducing a plurality of inorganic nanowires onto a surface of the layer of cross-linkable polymer and embedding at least some of the plurality of inorganic nanowires into the layer of cross-linkable polymer to form an inorganic mesh within the layer of cross-linkable polymer, thereby forming the composite conductive film. The method further includes cross-linking the cross-linkable polymer within at least a surface portion of the composite conductive film, wherein following the cross-linking, the cross-linkable polymer within at least the surface portion of the composite conductive film is in a cross-linked state.


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