The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Aug. 22, 2018
Butterfly Network, Inc., Guilford, CT (US);
Jonathan M. Rothberg, Guilford, CT (US);
Susan A. Alie, Stoneham, MA (US);
Keith G. Fife, Palo Alto, CA (US);
Nevada J. Sanchez, Guilford, CT (US);
Tyler S. Ralston, Clinton, CT (US);
Butterfly Network, Inc., Guilford, CT (US);
Abstract
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.