The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

May. 02, 2016
Applicants:

Nortek Air Solutions Canada, Inc., Saskatoon, CA;

Philip Paul Lepoudre, Saskatoon, CA;

Manfred Gerber, Saskatoon, CA;

Inventors:

Philip Paul LePoudre, Saskatoon, CA;

Manfred Gerber, Saskatoon, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 9/00 (2006.01); F24F 12/00 (2006.01); F24F 13/30 (2006.01); H05K 7/20 (2006.01); F24F 3/14 (2006.01); F24F 5/00 (2006.01); F24F 11/46 (2018.01); F24F 11/83 (2018.01); F28D 15/00 (2006.01); F24F 11/63 (2018.01); F24F 110/10 (2018.01); F24F 11/00 (2018.01);
U.S. Cl.
CPC ...
F24F 12/00 (2013.01); F24F 3/1411 (2013.01); F24F 5/0003 (2013.01); F24F 5/0035 (2013.01); F24F 11/46 (2018.01); F24F 11/63 (2018.01); F24F 11/83 (2018.01); F24F 12/002 (2013.01); F24F 12/003 (2013.01); F24F 13/30 (2013.01); F28D 15/00 (2013.01); H05K 7/2079 (2013.01); H05K 7/20745 (2013.01); F24F 2003/1435 (2013.01); F24F 2011/0006 (2013.01); F24F 2012/005 (2013.01); F24F 2110/10 (2018.01); F24F 2203/02 (2013.01); F24F 2203/026 (2013.01); F24F 2203/104 (2013.01); Y02B 30/52 (2013.01); Y02B 30/563 (2013.01);
Abstract

An example system is configured to control conditions in an enclosed space. The system includes scavenger and process plenums, a liquid-to-air membrane energy exchanger (LAMEE), a first liquid-to-air heat exchanger (LAHX), a second LAHX, and a fluid circuit The scavenger plenum is configured to direct scavenger air from a scavenger inlet to a scavenger outlet. The process plenum is sealed from the scavenger plenum and is configured to direct process air from a process inlet to a process outlet The process inlet receives heated air from the space and the process outlet supplies cooled air to the space. The LAMEE is arranged inside the scavenger plenum. The LAMEE is configured to use the scavenger air to evaporatively cool a first fluid flowing through the LAMEE. The temperature of the first fluid at a LAMEE outlet is lower than the temperature of the first fluid at a LAMEE inlet. The first LAHX is arranged inside the process plenum. The first LAHX is configured to directly and sensibly cool the heated air from the space to a supply air temperature using a second fluid flowing through the first LAHX. The second LAHX is arranged inside the scavenger plenum downstream of the LAMEE. The second LAHX is configured to receive and cool the second fluid heated by the first LAHX using the scavenger air. The fluid circuit transports the first and second fluids among the LAMEE, the first LAHX, and the second LAHX.


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