The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Dec. 07, 2017
Applicant:

Nan Ya Plastics Corporation, Tapei, TW;

Inventors:

Te-Chao Liao, Taipei, TW;

Ying-Te Huang, Taipei, TW;

Hao-Sheng Chen, Taipei, TW;

Hung-Yi Chang, Taipei, TW;

Chia-Lin Liu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/5333 (2006.01); H05K 1/09 (2006.01); C08K 3/36 (2006.01); C08J 5/24 (2006.01); B32B 15/14 (2006.01); B32B 17/04 (2006.01); B32B 15/20 (2006.01); C08L 71/12 (2006.01); C08K 3/22 (2006.01); C08K 5/20 (2006.01); C08K 5/3492 (2006.01); C08K 5/52 (2006.01); C08K 3/26 (2006.01); C08K 5/523 (2006.01); C08K 5/02 (2006.01);
U.S. Cl.
CPC ...
C08K 5/5333 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 17/04 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08L 71/12 (2013.01); C08L 71/126 (2013.01); H05K 1/09 (2013.01); C08K 5/02 (2013.01); C08K 5/20 (2013.01); C08K 5/34922 (2013.01); C08K 5/523 (2013.01); C08K 5/5205 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2224 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/265 (2013.01); C08L 2205/02 (2013.01);
Abstract

A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.


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