The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Nov. 21, 2016
Applicants:

Denso Corporation, Kariya, Aichi-pref., JP;

Denso Korea Automotive Corporation, Changwon-si, Gyeongsangnam-do, KR;

Inventors:

Shingo Fukuoka, Kari ya, JP;

Yutaka Niwa, Kariya, JP;

Sanghoon Lee, Changwon-si, KR;

Hyoyeol Kim, Changwon-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60K 15/05 (2006.01); B60K 15/03 (2006.01); F02M 37/14 (2006.01); F02M 37/30 (2019.01); F02M 37/10 (2006.01); F02D 33/00 (2006.01); F02M 37/08 (2006.01); F02M 25/08 (2006.01);
U.S. Cl.
CPC ...
B60K 15/05 (2013.01); B60K 15/03 (2013.01); F02D 33/003 (2013.01); F02M 37/08 (2013.01); F02M 37/103 (2013.01); F02M 37/14 (2013.01); F02M 37/30 (2019.01); B60K 2015/03243 (2013.01); B60K 2015/03467 (2013.01); F02M 25/089 (2013.01); F02M 2037/085 (2013.01);
Abstract

A primary metal terminal connects between a fuel pump and a drive circuit through a resin lid. A primary connecting point of the primary metal terminal connected to the drive circuit, is positioned around a drive control IC, and a primary exposed portion of the primary metal terminal, exposed to a receiving space of the resin lid is bent such that the primary exposed portion is resiliently deformable. A secondary metal terminal connects between an external circuit system and the drive circuit through the resin lid. A secondary connecting point of the secondary metal terminal connected to the drive circuit is positioned at a location that is further spaced from the drive control IC in comparison to the primary connecting point, and a secondary exposed portion of the secondary metal terminal exposed to the receiving space has a stiffness higher than a stiffness of the primary exposed portion.


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