The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Sep. 28, 2016
Kyoraku Co., Ltd., Kyoto, JP;
KYORAKU CO., LTD., Kyoto, JP;
Abstract
A method of manufacturing a foam molded article is disclosed. The method includes the steps of extruding a molten, kneaded resin containing a foaming agent through an annular slit between a die core and a die shell, surrounding the die core to form a cylindrical foam parison, extruding the parison between a pair of split molds, pinching the parison between lower pinchers disposed under the split molds, and molding the parison by closing the split molds. H/D is 1.33 to 3.33 and L/D is 0.33 to 2.00, D being a die core diameter, H being a distance between a lower surface of the die core and an upper surface of each of the split molds, and L being a distance between a lower surface of each of the split molds and an upper surface of the corresponding lower pincher. The die core diameter is between 50 and 300 mm.