The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Feb. 24, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Zhiwei Wu, Shanghai, CN;

Yanmin Li, Shanghai, CN;

David Henry Abbott, Mason, OH (US);

Xiaobin Chen, Shanghai, CN;

Thomas Froats Broderick, Springboro, OH (US);

Judson Sloan Marte, Troy, NY (US);

Andrew Philip Woodfield, Maineville, OH (US);

Eric Allen Ott, Cincinnati, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 5/00 (2006.01); B22F 3/15 (2006.01); B22F 3/12 (2006.01); B33Y 10/00 (2015.01); B22F 3/105 (2006.01); B22F 3/02 (2006.01); B22F 3/04 (2006.01); B22F 3/26 (2006.01); B22F 7/04 (2006.01); B23K 15/00 (2006.01);
U.S. Cl.
CPC ...
B22F 5/00 (2013.01); B22F 3/02 (2013.01); B22F 3/04 (2013.01); B22F 3/1055 (2013.01); B22F 3/12 (2013.01); B22F 3/1208 (2013.01); B22F 3/15 (2013.01); B22F 3/26 (2013.01); B22F 7/04 (2013.01); B23K 15/0086 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12); Y02P 10/25 (2015.11);
Abstract

A method for manufacturing a three-dimensional part. The method includes: performing partial densification processing on loose machining powder, to form a densified and sealed enclosure, where there is still loose machining powder accommodated inside the enclosure; and performing overall densification processing on the enclosure and the machining powder inside the enclosure, so as to implement metallurgical bonding between the machining powder inside the enclosure and the enclosure during the densification, thereby forming a target three-dimensional part.


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