The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Dec. 01, 2014
Applicants:

Michael Knox, Manhasset, NY (US);

Andrew Ippoliti, Yonkers, NY (US);

Georgios Kyriakou, Brooklyn, NY (US);

Carlos Ospina, New York, NY (US);

Nicolas Vansnick, Brooklyn, NY (US);

Inventors:

Michael Knox, Manhasset, NY (US);

Andrew Ippoliti, Yonkers, NY (US);

Georgios Kyriakou, Brooklyn, NY (US);

Carlos Ospina, New York, NY (US);

Nicolas Vansnick, Brooklyn, NY (US);

Assignee:

BotFactory, Inc., Long Island City, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0408 (2013.01); H05K 3/1241 (2013.01); H05K 3/3484 (2013.01); H05K 3/4685 (2013.01); H05K 13/0469 (2013.01); H05K 2203/013 (2013.01); H05K 2203/0126 (2013.01);
Abstract

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.


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