The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Dec. 08, 2017
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Hiesang Sohn, Seoul, KR;
Seyun Kim, Seoul, KR;
Haengdeog Koh, Hwaseong-si, KR;
Doyoon Kim, Hwaseong-si, KR;
Soichiro Mizusaki, Suwon-si, KR;
Jinhong Kim, Seoul, KR;
Hajin Kim, Hwaseong-si, KR;
Minjong Bae, Yongin-si, KR;
Changsoo Lee, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 1/02 (2006.01); H05B 3/14 (2006.01); B29C 70/88 (2006.01); C03C 14/00 (2006.01); B29C 70/02 (2006.01); C03C 4/14 (2006.01); C03C 17/00 (2006.01); C03C 8/16 (2006.01); C03C 8/14 (2006.01); H05B 3/26 (2006.01);
U.S. Cl.
CPC ...
H05B 1/0263 (2013.01); B29C 70/025 (2013.01); B29C 70/88 (2013.01); C03C 4/14 (2013.01); C03C 8/14 (2013.01); C03C 8/16 (2013.01); C03C 14/004 (2013.01); C03C 17/007 (2013.01); C03C 17/008 (2013.01); H05B 3/14 (2013.01); H05B 3/141 (2013.01); H05B 3/146 (2013.01); H05B 3/26 (2013.01); C03C 2217/452 (2013.01); C03C 2217/48 (2013.01); H05B 2203/013 (2013.01);
Abstract
A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.