The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Oct. 19, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 1/14 (2006.01); H02K 7/14 (2006.01); H02K 9/06 (2006.01); A47L 9/22 (2006.01); H02K 1/27 (2006.01); H02K 1/28 (2006.01); H02K 9/14 (2006.01); H02K 15/03 (2006.01); H02K 11/33 (2016.01); F04D 17/16 (2006.01); F04D 25/06 (2006.01); F04D 29/26 (2006.01); H02K 7/00 (2006.01); H02K 1/18 (2006.01); H02K 3/52 (2006.01);
U.S. Cl.
CPC ...
H02K 7/14 (2013.01); A47L 9/22 (2013.01); F04D 17/165 (2013.01); F04D 25/0606 (2013.01); F04D 29/263 (2013.01); H02K 1/148 (2013.01); H02K 1/2733 (2013.01); H02K 1/28 (2013.01); H02K 7/003 (2013.01); H02K 9/06 (2013.01); H02K 9/14 (2013.01); H02K 11/33 (2016.01); H02K 15/03 (2013.01); F05D 2260/37 (2013.01); H02K 1/185 (2013.01); H02K 3/522 (2013.01); H02K 2213/03 (2013.01);
Abstract
A motor assembly of the present disclosure improves a combined structure between an impeller and a rotor to more firmly combine them. Furthermore, the impeller is combined with a rotor shaft without deformation, so the durability of the respective components may be improved.