The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jan. 30, 2019
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Yuta Ishige, Tokyo, JP;
Etsuji Katayama, Tokyo, JP;
Atsushi Oguri, Tokyo, JP;
Hajime Mori, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); H01S 5/40 (2006.01); H01S 3/067 (2006.01); H01S 3/0941 (2006.01); H01S 3/23 (2006.01); H01S 3/094 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02208 (2013.01); H01S 3/06754 (2013.01); H01S 3/0941 (2013.01); H01S 3/2383 (2013.01); H01S 5/02216 (2013.01); H01S 5/02284 (2013.01); H01S 5/4012 (2013.01); H01S 5/4025 (2013.01); H01S 5/4075 (2013.01); H01S 3/0675 (2013.01); H01S 3/09415 (2013.01); H01S 3/094003 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01S 5/02288 (2013.01); H01S 5/02292 (2013.01); H01S 5/4018 (2013.01);
Abstract
Provided is a laser apparatus and a light source apparatus that can reduce the footprint and realize space-saving. The laser apparatus has a bottom plate; a semiconductor laser element mounted on the bottom plate; and a terminal unit that is provided so as to face upward with respect to the bottom plate and enables external electrical connection.