The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Mar. 08, 2019
Applicant:

Aac Technologies Pte. Ltd., Singapore, SG;

Inventors:

Tan Yew Choon, Singapore, SG;

Ng Guan Hong, Singapore, SG;

Tay Yew Siow, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/06 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 13/10 (2006.01); H01Q 21/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/064 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 13/10 (2013.01); H01Q 21/22 (2013.01);
Abstract

The present invention provides a millimeter wave array antenna including: two metal grounding layers and a sandwich metal layer between the two metal grounding layers. The sandwich metal layer includes a top surface, a bottom surface and a plurality of antenna slots. The top surface is connected with the two metal grounding layers along a long axis direction, the bottom surface is opposite to and in parallel with the top surface, the antenna slots space the array along the long axis direction, penetrate the top surface and bottom surface and are connected with the two metal grounding layers. The metal grounding layers are provided with feed parts at positions corresponding to each antenna slot, and, each of the antenna slots, the metal grounding layers and the sandwich metal layer forms a slot antenna unit.


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