The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Oct. 24, 2017
Applicant:

Anokiwave, Inc., San Diego, CA (US);

Inventors:

Vipul Jain, Irvine, CA (US);

Noyan Kinayman, Harvard, MA (US);

Robert J. McMorrow, Concord, MA (US);

Kristian N. Madsen, Napa, CA (US);

Shamsun Nahar, San Diego, CA (US);

Nitin Jain, San Diego, CA (US);

Assignee:

ANOKIWAVE, INC., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 3/36 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 23/66 (2006.01); H01P 3/02 (2006.01); H01P 3/08 (2006.01); H01Q 3/26 (2006.01); H04B 7/06 (2006.01); H04L 27/26 (2006.01);
U.S. Cl.
CPC ...
H01Q 3/36 (2013.01); H01L 23/3672 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01P 3/026 (2013.01); H01P 3/08 (2013.01); H01P 3/081 (2013.01); H01Q 3/26 (2013.01); H04B 7/0617 (2013.01); H04B 7/0626 (2013.01); H04B 7/0639 (2013.01); H04L 27/2607 (2013.01); H04L 27/2634 (2013.01); H05K 1/0206 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/00014 (2013.01); H05K 2201/066 (2013.01);
Abstract

A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, and a plurality of (on chip) interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a signal interface, a first ground interface, and a second ground interface. The signal interface is configured to communicate an RF signal, and both the first and second ground interfaces are adjacent to the signal interface. The system also has a material ring circumscribing the plurality of interfaces, and at least one RF ground path coupled with the material ring.


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