The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Nov. 12, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/73 (2006.01); H01L 29/732 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7302 (2013.01); H01L 23/3178 (2013.01); H01L 24/13 (2013.01); H01L 29/41708 (2013.01); H01L 29/7325 (2013.01); H01L 2924/1305 (2013.01);
Abstract
A semiconductor device has bipolar transistors on a substrate. There is also an insulating film on the substrate, covering the bipolar transistors. On this insulating film is emitter wiring, sticking through openings in the insulating film (first openings) to be electrically coupled to the emitter layer of the bipolar transistors. On the emitter wiring is a protective film. On the protective film is a bump, sticking through an opening in the protective film (second opening) to be electrically coupled to the emitter wiring. In plan view, the second opening is included in the area that is inside the bump and outside the first openings.