The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jun. 04, 2018
Applicant:
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Inventors:
Kenji Hayashi, Kyoto, JP;
Akihiro Suzaki, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 23/36 (2006.01); H01L 29/739 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 25/07 (2013.01); H01L 29/7393 (2013.01); H01L 23/3107 (2013.01); H01L 23/4334 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.