The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
May. 26, 2017
Applicant:
Exagan, Grenoble, FR;
Inventors:
Assignee:
Exagan, Grenoble, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H03K 17/10 (2006.01); H01L 23/00 (2006.01); H01L 23/043 (2006.01); H01L 23/495 (2006.01); H03F 1/22 (2006.01); H03F 3/195 (2006.01); H01L 25/18 (2006.01); H03K 17/082 (2006.01); H01L 21/8236 (2006.01); H01L 27/088 (2006.01); H01L 25/07 (2006.01); H03K 17/687 (2006.01); H01L 23/62 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 21/8236 (2013.01); H01L 23/043 (2013.01); H01L 23/4952 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/49 (2013.01); H01L 25/18 (2013.01); H01L 27/0883 (2013.01); H03F 1/223 (2013.01); H03F 3/195 (2013.01); H03K 17/0822 (2013.01); H03K 17/102 (2013.01); H01L 23/62 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19107 (2013.01); H03K 2017/6875 (2013.01);
Abstract
An integrated circuit comprises a housing, a plurality of connection pins, a first chip that includes a high-voltage depletion mode transistor, and a second chip that includes a low-voltage enhancement mode transistor. The first chip and second chip each comprise a gate bump contact, a drain bump contact and a source bump contact. The source bump contact of the high-voltage transistor is electrically connected to the drain bump contact of the low-voltage transistor so as to form a central node of the circuit. The circuit includes at least one first Kelvin pin that is electrically connected to the source bump contact of the low-voltage transistor.