The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Feb. 23, 2016
Applicant:
Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;
Inventors:
Yoshinori Deguchi, Gunma, JP;
Akinobu Watanabe, Tokyo, JP;
Assignee:
Renesas Electronics Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/66 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/3205 (2013.01); H01L 21/768 (2013.01); H01L 22/32 (2013.01); H01L 23/522 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/45 (2013.01); H01L 2224/05 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device having a plurality of wiring layers including a first wiring layer and a second wiring layer, with the first wiring layer being the uppermost layer and including a pad PD that has a first region for bonding a copper wire, and a second region for bringing a probe into contact with the pad. The second wiring layer is one layer below the first wiring layer and includes a first wiring line arranged immediately below the second region of the pad, the second wiring layer having no conductor pattern at a region overlapping with the first region of the pad PD.