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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10777499 B1

PDFFull Text
Date of Patent:
Sep. 15, 2020

Filed:

May. 03, 2018

Semiconductor module, method for manufacturing the same and power conversion apparatus

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yasuo Tanaka, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Ermias T Woldegeorgis

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01); H02M 7/537 (2006.01); H01L 21/48 (2006.01); H02M 7/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49872 (2013.01); H01L 21/4807 (2013.01); H01L 21/4875 (2013.01); H01L 23/15 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/49866 (2013.01); H01L 25/072 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H01L 23/49861 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A conductive thin-film thinner than the undersurface electrode is provided outside the undersurface electrode on the undersurface of the ceramic substrate and connected to the undersurface electrode. A length from an outer circumferential part of the undersurface electrode to an outer circumferential pert of the ceramic substrate is equal to a length from an outer circumferential part of the top surface electrode to an outer circumferential part of the ceramic substrate. A thickness of the conductive thin-film is half or less than a thickness of the ceramic substrate.

Find Patent Forward Citations

Tanaka, Yasuo. (2020). Semiconductor module, method for manufacturing the same and power conversion apparatus (U.S. Patent No. 10777499). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10777499

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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