The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Oct. 11, 2018
Applicant:
The Goodsystem Corp., Ansan-si, Gyeonggi-do, KR;
Inventors:
Assignee:
THE GOODSYSTEM CORP., Ansan-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); H01L 23/373 (2006.01); B32B 3/26 (2006.01); B32B 15/04 (2006.01); C22C 9/00 (2006.01); C22C 27/04 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B32B 3/26 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C22C 9/00 (2013.01); C22C 27/04 (2013.01); F28F 21/085 (2013.01); H01L 23/373 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2264/108 (2013.01); B32B 2307/302 (2013.01); F28F 2255/06 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12903 (2015.01);
Abstract
A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.