The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jun. 09, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Yuki Okabe, Tokyo, JP;
Takanobu Kajihara, Tokyo, JP;
Junya Suzuki, Tokyo, JP;
Muneaki Mukuda, Tokyo, JP;
Hiroyuki Miyanishi, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;
Abstract
This semiconductor device includes: a first insulation resin portion formed on the mounting surface side of a lead frame; a second insulation resin portion formed on the heat dissipation surface side of the lead frame; and a heatsink fixed to the heat dissipation surface of the second insulation resin portion, wherein the second insulation resin portion has a second skirt portion formed at an end of a thin molded portion, the first insulation resin portion has a first skirt portion covering the second skirt portion, and an outer peripheral surface part of the second skirt portion has a first end connected to the lead frame and the first skirt portion, a second end connected to the heatsink, and at least one bent portion formed between the first end and the second end.