The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Dec. 14, 2017
Applicant:
Semes Co., Ltd., Cheonan-si, Chungcheongnam-do, KR;
Inventors:
Yoon Ki Sa, Seoul, KR;
Mong Ryong Lee, Suwon-si, KR;
Assignee:
SEMES CO., LTD., Cheonan-si, Chungcheongnam-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); C25D 13/12 (2006.01); H01L 23/48 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); C25D 13/12 (2013.01); H01L 21/2885 (2013.01); H01L 23/481 (2013.01);
Abstract
A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.