The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Apr. 05, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Markus J. Stopper, Voerstetten, DE;

Asaf Schlezinger, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); B07C 5/10 (2006.01); B07C 5/342 (2006.01); B07C 5/344 (2006.01); G01B 11/00 (2006.01); G01N 21/64 (2006.01); G01N 21/95 (2006.01); G01N 21/84 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67271 (2013.01); H01L 21/67766 (2013.01); H01L 21/6838 (2013.01); B07C 5/10 (2013.01); B07C 5/342 (2013.01); B07C 5/344 (2013.01); G01B 11/00 (2013.01); G01N 21/6489 (2013.01); G01N 21/9501 (2013.01); G01N 2021/845 (2013.01); H01L 21/67769 (2013.01); H01L 22/12 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to expandable substrate inspection systems. The inspection system includes multiple metrology units adapted to inspect, detect, or measure one or more characteristics of a substrate, including thickness, resistivity, saw marks, geometry, stains, chips, micro cracks, and crystal fraction. The inspection systems may be utilized to identify defects on substrates and estimate cell efficiency prior to processing a substrate. Substrates may be transferred through the inspection system and/or between metrology units on a track or conveyor, and then sorted via at least one gripper coupled with the high speed rotatory sorting apparatus into respective bins based upon the inspection data. The rotary sorting apparatus maintains a sorting capability of at least 5,400 substrates per hour. Each bin may optionally have a gas support cushion for supporting the substrate as it falls from the rotary sorting apparatus into the respective bin.


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