The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Apr. 16, 2019
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Hiroyuki Okada, Kyoto, JP;
Yasuhiro Fuwa, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 4/33 (2006.01); H01G 4/40 (2006.01); H01G 5/38 (2006.01); H01G 4/015 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01); H01G 5/011 (2006.01);
U.S. Cl.
CPC ...
H01G 4/385 (2013.01); H01G 4/015 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01G 5/011 (2013.01); H01G 5/38 (2013.01); H01L 27/016 (2013.01); H01L 28/40 (2013.01);
Abstract
A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.