The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Nov. 27, 2019
Sumida Corporation, Chuo-Ku, Tokyo, JP;
Shinichi Sakamoto, Tokyo, JP;
Douglas James Malcolm, Kingston, CA;
SUMIDA CORPORATION, , JP;
Abstract
A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.