The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

May. 09, 2018
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;

Inventors:

Toshiyuki Tsuchida, Mie, JP;

Shigeki Yamane, Mie, JP;

Assignees:

AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 27/06 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/06 (2013.01); H01F 27/24 (2013.01); H01F 27/2823 (2013.01); H05K 1/0203 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H01F 2027/065 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1003 (2013.01);
Abstract

A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.


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