The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
May. 11, 2018
Ajoho Enterprise Co., Ltd., Taipei, TW;
Chia-Ping Mo, Taipei, TW;
You-Chi Liu, Taipei, TW;
Ajoho Enterprise Co., Ltd., Taipei, TW;
Abstract
An electronic device wire conductor formation method includes the steps of using a plastic injection molding machine to create an insulative plastic block, operating a top mold of a transfer-printing equipment to reciprocate an adhesive-applying portion along a transfer-printing portion of a bottom mold for causing the adhesive-applying portion to coat a molten conductive adhesive evenly on the transfer-printing portion, inverting the insulative plastic block to attach molding units thereof onto the transfer-printing portion of the bottom mold for enabling the molten conductive adhesive to be transfer-printed onto U-shaped plates of the molding units, and finally removing the insulative plastic block from the bottom mold and then curing the coated conductive adhesive to form individual conductors on the respective U-shaped plate of molding units.