The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Mar. 09, 2017
Agency for Science, Technology and Research, Singapore, SG;
Xiaoming Yin, Singapore, SG;
Jian Xu, Singapore, SG;
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, Singapore, SG;
Abstract
Systems and methods for self-determining optical inspection of wire bonds of semiconductor components. The method is an automated optical wire bond inspection method that may include obtaining an image of a semiconductor component having wire bonds. The method may also include detecting a plurality of wire bonds on the semiconductor component image so that a wire between at least two of the plurality of detected wire bonds may be detected. Further, the method may include determining an inspection region of interest corresponding to at least one detected wire bond and at least one detected wire. The method may then include inspecting the detected wire bond along the region of interest.