The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

May. 07, 2018
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Cyril Adair Keilers, Georgetown, TX (US);

Shawn Paul Hoss, Georgetown, TX (US);

Christopher Michael Helberg, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); G06F 2200/201 (2013.01);
Abstract

A forced convection system includes a chassis defining a chassis housing and including an outer surface opposite the chassis housing. A forced convection device channel is defined by the chassis adjacent the outer surface and opposite the chassis housing. A heat dissipation structure extends from the chassis adjacent the outer surface, opposite the chassis housing, and adjacent the forced convection device channel. A first heat producing device is located in the chassis housing and engages the chassis immediately opposite the heat dissipation structure to allow the chassis and the heat dissipation structure to conduct heat generated by the first heat producing device. A forced convection device is located in the forced convection device channel, and produces a forced convective airflow past the heat dissipation structure to dissipate the heat generated by the first heat producing device and conducted by the chassis and the heat dissipation structure.


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