The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Aug. 24, 2017
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Heiko Stahl, Reutlingen, DE;

Arne Dannenberg, Metzingen, DE;

Daniel Haug, Neuffen, DE;

Daniel Kaercher, Stuttgart, DE;

Michaela Mitschke, Reutlingen, DE;

Mike Schwarz, Kusterdingen, DE;

Timo Lindemann, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); G01L 9/00 (2006.01); H01L 41/27 (2013.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/008 (2013.01); B81B 3/0018 (2013.01); B81C 1/00325 (2013.01); H01L 41/27 (2013.01); B81B 2201/0264 (2013.01);
Abstract

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.


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