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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10775023 B1

PDFFull Text
Date of Patent:
Sep. 15, 2020

Filed:

Sep. 20, 2019

Wavelength conversion member complex, light emitting device, and method for manufacturing wavelength conversion member complex

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Takuya Sugimura, Tokushima, JP;

Naoki Eboshi, Tokushima, JP;

Takeshi Ikegami, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:

Global IP Counselors, LLP

Primary Examiner:

Laura K Tso

Int. Cl.
CPC ...
F21V 21/00 (2006.01); F21V 9/30 (2018.01); H01L 33/48 (2010.01); F21V 29/502 (2015.01); F21V 29/85 (2015.01); F21V 29/70 (2015.01); B32B 7/12 (2006.01); B32B 3/26 (2006.01); B32B 18/00 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); H01L 33/50 (2010.01); F21Y 115/30 (2016.01);
U.S. Cl.
CPC ...
F21V 9/30 (2018.02); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 18/00 (2013.01); B32B 37/12 (2013.01); B32B 37/18 (2013.01); B32B 38/0008 (2013.01); F21V 29/502 (2015.01); F21V 29/70 (2015.01); F21V 29/86 (2015.01); H01L 33/483 (2013.01); H01L 33/507 (2013.01); B32B 2307/302 (2013.01); B32B 2307/42 (2013.01); B32B 2307/422 (2013.01); B32B 2310/0843 (2013.01); B32B 2315/02 (2013.01); B32B 2457/00 (2013.01); F21Y 2115/30 (2016.08);
Abstract

A wavelength conversion member complex includes a wavelength conversion member, a joining material, and a heat dissipation member. The wavelength conversion member includes a support and a phosphor member. The support defines a through-hole extending from an upper surface to a lower surface. The support has a concave portion on the lower surface around the through-hole. The concave portion is spaced apart from the through-hole. The phosphor member is disposed in the through-hole and includes a phosphor. The lower surface of the phosphor member is continuous with the lower surface of the support. The joining material is disposed in the concave portion, and has a lower surface that is flush with the lower surface of the support. The heat dissipation member is disposed under the joining material and the phosphor member, and has an upper surface in contact with the lower surface of the joining material.

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