The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Apr. 04, 2019
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Yu Nakamura, Tokyo, JP;

Kazuya Konishi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 31/0312 (2006.01); C30B 25/20 (2006.01); C30B 29/36 (2006.01); H01L 29/36 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 29/08 (2006.01); H01L 29/16 (2006.01); C30B 25/18 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 21/205 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
C30B 25/20 (2013.01); C30B 25/186 (2013.01); C30B 29/36 (2013.01); H01L 21/02378 (2013.01); H01L 21/02447 (2013.01); H01L 21/02505 (2013.01); H01L 21/02529 (2013.01); H01L 21/02576 (2013.01); H01L 21/02579 (2013.01); H01L 21/205 (2013.01); H01L 29/0878 (2013.01); H01L 29/1608 (2013.01); H01L 29/36 (2013.01); H01L 29/66068 (2013.01); H01L 29/7802 (2013.01); H01L 29/7813 (2013.01); H01L 29/8613 (2013.01); H01L 29/0615 (2013.01);
Abstract

A silicon carbide epitaxial substrate includes a silicon carbide single-crystal substrate of one conductivity type, a first silicon carbide layer of the above-mentioned one conductivity type, a second silicon carbide layer of the above-mentioned one conductivity type, and a third silicon carbide layer of the above-mentioned one conductivity type. The silicon carbide single-crystal substrate has first impurity concentration. The first silicon carbide layer is provided on the silicon carbide single-crystal substrate, and has second impurity concentration that is lower than the first impurity concentration. The second silicon carbide layer is provided on the first silicon carbide layer, and has third impurity concentration that is higher than the first impurity concentration. The third silicon carbide layer is provided on the second silicon carbide layer, and has fourth impurity concentration that is lower than the second impurity concentration.


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