The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jul. 02, 2019
Applicant:
Stanley Electric Co., Ltd., Meguro-ku, Tokyo, JP;
Inventors:
Hiroto Fukushima, Tokyo, JP;
Akihiko Hanya, Tokyo, JP;
Assignee:
STANLEY ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/14 (2006.01); C09D 11/52 (2014.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B22F 9/16 (2006.01); H05K 3/12 (2006.01); H05K 1/02 (2006.01); C09D 11/037 (2014.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B22F 1/0022 (2013.01); B22F 1/02 (2013.01); B22F 9/16 (2013.01); C09D 11/037 (2013.01); H05K 1/0204 (2013.01); H05K 1/09 (2013.01); H05K 3/1283 (2013.01); B22F 2009/165 (2013.01); B22F 2301/255 (2013.01); B22F 2304/054 (2013.01); H05K 1/181 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/037 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1131 (2013.01);
Abstract
An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.