The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Jul. 07, 2017
Applicant:

Matsumoto Yushi-seiyaku Co., Ltd., Yao-shi, Osaka, JP;

Inventors:

Naoya Tayagaki, Yao, JP;

Katsushi Miki, Yao, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/20 (2006.01); C08J 9/16 (2006.01); C08J 9/228 (2006.01); C08J 9/232 (2006.01); C08J 9/32 (2006.01); C08F 2/18 (2006.01); C08F 2/44 (2006.01); C08L 27/06 (2006.01); B01J 13/18 (2006.01); C08F 220/48 (2006.01); C08F 220/46 (2006.01); C08L 33/18 (2006.01); C08J 9/14 (2006.01);
U.S. Cl.
CPC ...
C08J 9/32 (2013.01); B01J 13/18 (2013.01); C08F 2/18 (2013.01); C08F 2/44 (2013.01); C08F 220/46 (2013.01); C08F 220/48 (2013.01); C08J 9/16 (2013.01); C08L 27/06 (2013.01); C08L 33/18 (2013.01); C08J 9/141 (2013.01); C08J 2333/18 (2013.01); C08L 2205/20 (2013.01); C08L 2207/53 (2013.01);
Abstract

Hollow resin particles, a production process for producing the same and application thereof. The hollow resin particles include a thermoplastic resin shell and a hollow part surrounded by the shell. The thermoplastic resin is a polymer produced from a polymerizable component containing 0.6 to 3.0 wt % of a crosslinkable monomer having at least two polymerizable carbon-carbon double bonds per molecule and 97 to 99.4 wt % of an uncrosslinkable monomer having one polymerizable carbon-carbon double bond per molecule. A blowing agent is encapsulated in the hollow resin particles. The blowing agent contains 50 to 100 wt % of an organic compound having a vapor pressure higher than 100 kPa at 25° C. Further, the encapsulation ratio of the blowing agent ranges from 3 to 13 wt % of the hollow resin particles.


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