The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jun. 29, 2017
Applicant:
Kolon Industries, Inc., Seoul, KR;
Inventors:
Assignee:
KOLON INDUSTRIES, INC., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 59/56 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08G 59/46 (2006.01); C08L 63/08 (2006.01); C08K 5/357 (2006.01); C08G 59/50 (2006.01); C08K 5/00 (2006.01); C08K 5/17 (2006.01); C08G 59/42 (2006.01); C08K 5/10 (2006.01); C08G 59/62 (2006.01); C08G 59/64 (2006.01); C08G 73/22 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); C08G 59/40 (2013.01); C08G 59/4014 (2013.01); C08G 59/4021 (2013.01); C08G 59/42 (2013.01); C08G 59/46 (2013.01); C08G 59/504 (2013.01); C08G 59/5033 (2013.01); C08G 59/5046 (2013.01); C08G 59/56 (2013.01); C08G 59/62 (2013.01); C08G 59/64 (2013.01); C08G 73/22 (2013.01); C08J 5/24 (2013.01); C08K 5/0025 (2013.01); C08K 5/10 (2013.01); C08K 5/17 (2013.01); C08K 5/357 (2013.01); C08L 63/08 (2013.01); C08J 2363/00 (2013.01); H05K 1/0366 (2013.01);
Abstract
The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.