The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Oct. 18, 2018
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Boris Curuvija, West Bloomfield, MI (US);

Fan Xu, Novi, MI (US);

Lihua Chen, Farmington Hills, MI (US);

Baoming Ge, Okemos, MI (US);

Assignee:

FORD GLOBAL TECHNOLOGIES, LLC, Dearborn, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B60L 50/40 (2019.01); B60L 3/00 (2019.01); H02M 1/32 (2007.01); H02H 7/122 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
B60L 50/40 (2019.02); B60L 3/003 (2013.01); H02H 7/1222 (2013.01); H02M 1/32 (2013.01); H02M 7/53871 (2013.01); H02M 2001/322 (2013.01);
Abstract

A shared resistor performs precharging and discharging functions of capacitors in an electric vehicle drive system. In a precharge state, the shared resistor is connected between the capacitors and a DC source via a precharge relay. In a discharge state, the resistor is connected across the capacitors via a discharge transistor. Otherwise, the resistor is disconnected. A bypass switch is connected between the resistor and an input capacitor. The bypass switch is rendered conductive during the precharge state and during the discharge state. The discharge transistor is activated only during the discharge state. As a result, the invention uses less components by virtue of eliminating separate resistance elements for pre-charging and discharging and by eliminating discharge switches dedicated to separate resistances. The circuit integration and the placement of components outside the inverter module improves overall system cost and packaging size.


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