The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Mar. 18, 2017
Applicant:

Cytec Industries Inc., Woodland Park, NJ (US);

Inventors:

Leonard MacAdams, Woolwich Township, NJ (US);

Dalip Kohli, Churchville, MD (US);

Assignee:

CYTEC INDUSTRIES INC., Woodland Park, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); C08J 5/24 (2006.01); C09J 5/02 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B29C 65/50 (2006.01); B29C 65/02 (2006.01); C09J 163/00 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/38 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); B32B 27/20 (2006.01); C09J 163/04 (2006.01); B29C 70/54 (2006.01); B32B 38/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1207 (2013.01); B29C 65/02 (2013.01); B29C 65/4835 (2013.01); B29C 65/5057 (2013.01); B29C 66/0224 (2013.01); B29C 66/1122 (2013.01); B29C 66/30322 (2013.01); B29C 66/45 (2013.01); B29C 66/721 (2013.01); B29C 66/7394 (2013.01); B29C 66/73161 (2013.01); B29C 66/73751 (2013.01); B32B 5/02 (2013.01); B32B 5/12 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 37/0038 (2013.01); B32B 37/025 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); C08J 5/24 (2013.01); C09J 5/02 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/72143 (2013.01); B29C 66/73941 (2013.01); B29C 70/54 (2013.01); B29L 2031/30 (2013.01); B32B 2037/1253 (2013.01); B32B 2038/0076 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/10 (2013.01); B32B 2305/188 (2013.01); B32B 2305/74 (2013.01); B32B 2315/085 (2013.01); B32B 2363/00 (2013.01); B32B 2605/18 (2013.01); C08J 2363/00 (2013.01); C08J 2363/04 (2013.01); C08J 2463/02 (2013.01); C09J 2463/003 (2013.01); Y10T 428/249921 (2015.04);
Abstract

Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.


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