The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Aug. 29, 2014
Applicant:

Gunze Limited, Ayabe-shi, Kyoto, JP;

Inventors:

Kiyoyasu Ishikawa, Shiga, JP;

Naoyuki Maruichi, Shiga, JP;

Yuki Ohama, Shiga, JP;

Assignee:

GUNZE LIMITED, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/30 (2006.01); G09F 3/04 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 7/12 (2006.01); B32B 7/04 (2019.01); C08L 25/08 (2006.01); C08L 25/10 (2006.01); C08L 67/03 (2006.01); C08L 67/02 (2006.01); C09J 125/10 (2006.01); C09J 125/08 (2006.01); C09J 167/02 (2006.01); C09J 167/03 (2006.01);
U.S. Cl.
CPC ...
B32B 27/302 (2013.01); B32B 27/08 (2013.01); B32B 27/30 (2013.01); B32B 27/36 (2013.01); G09F 3/04 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 2250/05 (2013.01); B32B 2250/24 (2013.01); B32B 2250/40 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/412 (2013.01); B32B 2307/546 (2013.01); B32B 2307/558 (2013.01); B32B 2307/736 (2013.01); B32B 2307/738 (2013.01); B32B 2307/75 (2013.01); B32B 2325/00 (2013.01); B32B 2367/00 (2013.01); B32B 2405/00 (2013.01); B32B 2519/00 (2013.01); C08L 25/08 (2013.01); C08L 25/10 (2013.01); C08L 67/02 (2013.01); C08L 67/025 (2013.01); C08L 67/03 (2013.01); C08L 2201/10 (2013.01); C08L 2203/16 (2013.01); C09J 125/08 (2013.01); C09J 125/10 (2013.01); C09J 167/02 (2013.01); C09J 167/025 (2013.01); C09J 167/03 (2013.01); C09J 2425/006 (2013.01); C09J 2467/006 (2013.01); Y10T 428/1328 (2015.01); Y10T 428/31786 (2015.04); Y10T 428/31797 (2015.04); Y10T 428/31909 (2015.04); Y10T 428/31913 (2015.04); Y10T 428/31917 (2015.04); Y10T 428/31924 (2015.04); Y10T 428/31931 (2015.04); Y10T 428/31938 (2015.04);
Abstract

The present invention provides a heat shrinkable multilayer film which has excellent adhesiveness between front and back layers and an interlayer not only at normal temperature but also at low temperature to effectively prevent delamination and is less likely to have residual white streaks along creases. The present invention also provides a heat shrinkable label including the heat shrinkable multilayer film. The present invention relates to a heat shrinkable multilayer film including: front and back layers each containing a polyester resin; an interlayer containing a polystyrene resin; and adhesive layers, the front and back layers and the interlayer being stacked with the adhesive layers interposed therebetween, the adhesive layers each containing 20 to 65% by weight of a polystyrene resin and 35 to 80% by weight of a polyester elastomer.


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